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Wang, Tianzhao; Liu, Xun; Schneiderman, Benjamin; Clark, Samuel J; Chuang, Andrew Chihpin; Yu, Zhenzhen (, Scripta Materialia)
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Pan, Qingsong; Yang, Muxin; Feng, Rui; Chuang, Andrew Chihpin; An, Ke; Liaw, Peter K; Wu, Xiaolei; Tao, Nairong; Lu, Lei (, Science)Coarse-grained materials are widely accepted to display the highest strain hardening and the best tensile ductility. We experimentally report an attractive strain hardening rate throughout the deformation stage at 77 kelvin in a stable single-phase alloy with gradient dislocation cells that even surpasses its coarse-grained counterparts. Contrary to conventional understanding, the exceptional strain hardening arises from a distinctive dynamic structural refinement mechanism facilitated by the emission and motion of massive multiorientational tiny stacking faults (planar defects), which are fundamentally distinct from the traditional linear dislocation–mediated deformation. The dominance of atomic-scale planar deformation faulting in plastic deformation introduces a different approach for strengthening and hardening metallic materials, offering promising properties and potential applications.more » « less
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Schneiderman, Benjamin; Hansen, Alexander; Chuang, Andrew Chihpin; Yu, Zhenzhen (, Journal of Manufacturing Processes)
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Luo, Yuting; Bai, Yang; Mistry, Aashutosh; Zhang, Yuwei; Zhao, Dexin; Sarkar, Susmita; Handy, Joseph V.; Rezaei, Shahed; Chuang, Andrew Chihpin; Carrillo, Luis; et al (, Nature Materials)
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